Adopting industry-leading low-corrosion paste, LIF technology, and multi-layer Poly-Si/POML technology, fully upgraded on TOPCon 3.0, cell efficiency is further improved by 0.3%-0.5%.

Compared with the 182*182mm silicon wafers, rectangular wafers have an area increase of 15.6%, enabling solar panels to achieve higher power output and significantly improving container utilization.

The super multi-busbar design increases the number of solder strips and main busbar solder points, resulting in a more uniform stress distribution of PV cells. This enhances tolerance to micro-cracks and broken grids and shortens the current transmission path; in this way, the series resistance is reduced, effectively enhancing current collection capability and improving optical utilization.

This solar panels is adaptable to a variety of application scenarios including utility-scale power stations, C&I and distributed rooftop projects, agri-PV solar farms, and offshore solar plants.

Compared with conventional solar module products, this module outperforms with higher power output under weak light conditions such as haze or cloudy weather. Even at an irradiance of 200W/m², it can maintain low-light performance at 97.8%.